Advantage or disadvantages of SMD over Through hole design in high frequencies? Ask Question. Asked 8 years, 1 month ago. Active 6 years, 1 month ago. Viewed 28k times. Antonio Burdy Antonio Burdy 1 1 gold badge 1 1 silver badge 5 5 bronze badges. Add a comment. Active Oldest Votes.
Advantages of SMD: 1-Smaller components. Fewer holes need to be drilled. Disadvantages of SMD: 1- Manual prototype assembly or component-level repair is more difficult 2-SMDs cannot be used directly with breadboards 3-SMDs' solder connections may be damaged by potting compounds going through thermal cycling.
Some surface mount components like BGAs are higher performing components with shorter leads and more interconnection pins that allow for higher speeds. There are perhaps too many terms that describe different aspects of surface mount technology. The taxonomy of surface mount devices SMDs is so expansive and ever-changing that covering it in full would be impossible. But here are several types that are very common and very important to know. Furthermore, one of their biggest disadvantages is their tendency to roll off solder pads during assembly.
Generally speaking, they come in the form of diodes, resistors, and capacitors. SOT Transistors and Diodes : These are usually rectangular and easy to place, though they're a bit outdated.
Its leads are typically gull wing. PLCCs can have roughly 18 — leads usually J-leads. Many of them can fit into IC sockets and can be easily replaced in the field. PLCCs have long been a popular option. These are usually designed for Mil Spec because, with no leads to damage, they're quite "rugged. They're design was highly influential on the now ubiquitous BGA. Flip Chip — Flip chips are bare die packages, with small bottom-side solder bumps that act as leads. They are soldered directly onto the PCB.
Because of their high density, BGAs are typically used to house microprocessors. Because fewer drilling holes are required, SMT allows for lower cost and faster production time. During assembly, SMT components can be placed at rates of thousands—even tens of thousands—of placements per hour, versus less than a thousand for THM. Solder joint formation is much more reliable and repeatable using programmed reflow ovens versus through techniques.
Whereas SMT components are secured only by solder on the surface of the board, through-hole component leads run through the board, allowing the components to withstand more environmental stress. This is why through-hole technology is commonly used in military and aerospace products that may experience extreme accelerations, collisions, or high temperatures.
Through-hole technology is also useful in test and prototyping applications that sometimes require manual adjustments and replacements. Enter the year of your birth and check your Chinese Zodiac. PCBWay Community. Search title or content Search. Login Sign Up. Ask questions Create a project. Hi PCB-Designers out there, Only through the use of so-called SMD components all necessary technical elements can be used on a platform with a short amout of surface. The standard sizes of SMD components are as follows, History and comparison In the course of the increasing miniaturization of electronic components, the components became smaller and smaller and other assembly methods had to be developed.
Advantages of both The advantage of this is the obvious gain in efficiency and cost savings, Which is why I opted for these components, despite the challenges in my own assembly during the prototype phase of my AZ-Envy. But in comparison: Through-hole components are best used for high-reliability products that require stronger connections between layers.
So overall its very important to look at your project needs and its cost during production!
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